AMD · 2025-05-01

Radeon AI PRO

R9700

The AMD Radeon AI PRO R9700 is a high-performance GPU designed for AI workloads, featuring 64 Compute Units, 128 AI Accelerators, and 32GB of GDDR6 memory. It is built on the AMD RDNA4 Architecture with hardware ray tracing capabilities.

Radeon AI PRO R9700
VRAM
96GB GB
FP32 TFLOPS
61 TFLOPS
TDP
300 W

Provider Marketplace

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$200.00/month
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$200.00/month
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$200.00/month
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HostkeyCheapest
On-DemandGlobal Availability
$200.00/ month
Estimated Cost
Provision

Compute Performance

FP64Not Published TFLOPS
FP3261 TFLOPS TFLOPS
TF32Not Supported TFLOPS
FP16245 TFLOPS TFLOPS
BF16245 TFLOPS TFLOPS
FP8Not Supported TFLOPS
INT8979 TOPS TOPS
INT4Not Published TOPS

Architecture

MicroarchitectureCDNA 3
Process NodeTSMC N5
Die Size
Transistors
Compute Units224 CUs
Tensor CoresAI Accelerators: 1792
RT Cores
Matrix EngineMatrix Core
Base Clock
Boost Clock
Transformer EngineYes (Gen 1)
Sparse AccelerationSupported (structured sparsity)
Dynamic PrecisionSupported (FP8/FP16/BF16/FP32)

Memory & VRAM

Memory TypeHBM3
Total Capacity96GB GB
Bandwidth3.5TB/s
Bus Width6144-bit
HBM Stacks6
ECC SupportYes (Inline)
Unified MemoryNot Supported
Compression
NUMA Awareness
Memory PoolingAMD Infinity Fabric pooling

Connectivity & Scaling

InterconnectInfinity Fabric
GenerationInfinity Fabric 4
IB Bandwidth900 GB/s
PCIe InterfacePCIe Gen 5 x16
CXL Support
TopologyFully-connected mesh via Infinity Fabric
Max GPUs/Node8
Scale-OutYes, via InfiniBand NDR/RoCE v2
GPUDirect RDMAYes
P2P MemoryYes

Virtualization

MIG SupportNot Supported
MIG PartitionsN/A
SR-IOVSupported
vGPU ReadinessSupported (AMD MxGPU)
K8s ReadinessSupported via Device Plugin
GPU SharingSR-IOV, vGPU, Time-Slicing
Virt EfficiencyNear bare-metal (vendor claim)

Power & Efficiency

TDP350 W W
Peak Power400-420 W
Idle Power40-60 W
Perf / Watt0.45-0.55 TFLOPS/W (FP16, theoretical)
PSU RequiredN/A
Connectors2x 8-pin PCIe
Thermal LimitsMax GPU temperature: 85°C
EfficiencyData center class, ~92% typical system PSU efficiency

Physical Design

Form FactorPCIe card
FHFLFull Height, Full Length
Slot WidthDual slot
Dimensions267 x 112 mm
Weight1.2–1.5 kg
CoolingPassive
Rack DensityStandard PCIe server GPU density

Thermals & Cooling

AirflowRequires server chassis airflow (Not Published)
Temp Range
ThrottlingStandard thermal protection
Noise LevelNot Applicable (Passive Module)
Liquid Cooling
DC HeatHigh (rack-scale deployment recommended)

Software Ecosystem

CUDANot Supported
ROCm
oneAPINot Supported
PyTorch
TensorFlow
JAX
HuggingFace
Triton Server
Docker
Compiler Stack
Kernel Optim
Driver Stability

Server & Deployment

OEM AvailabilityTier-1 OEMs: Dell, HPE, Supermicro
Preconfigured4U 8-GPU systems, 2U universal GPU servers
DGX/HGXNot applicable for DGX or HGX baseboards
Rack-ScaleInfiniBand scale-out, PCIe Gen5 connectivity
Edge DeploySuitable for edge deployments with moderate TDP considerations
Ref ArchitecturesCompatible with AMD ROCm and enterprise AI frameworks

System Compatibility

CPU PairingDual-socket EPYC 9004 class recommended
NUMAStandard NUMA behavior
Required PCIePCIe Gen 5 x16 recommended
MotherboardFull-length, double-width PCIe Gen 5 x16 slot required
Rack PowerContact vendor for rack power planning
BIOS Limits
CXL ReadyNo CXL memory expansion
OS CompatRHEL, Ubuntu LTS, Windows supported

Benchmarks & Throughput

Structured Sparsity

Not Supported

Multi-GPU Scalability

Scaling Efficiency

Single GPUThe Radeon AI PRO R9700 operates efficiently as a standalone unit, leveraging its full PCIe bandwidth.
2-GPUScaling between two GPUs is limited by PCIe lane contention, with potential bottlenecks in peer-to-peer communication.
4-GPUScaling across four GPUs is further constrained by PCIe Gen4's 32GB/s bandwidth, impacting data transfer rates.
8-GPUScaling to eight GPUs is suboptimal due to increased PCIe contention and lack of NVLink support, leading to diminished returns.
64+ GPUAt scales of 64+ GPUs, InfiniBand or Ethernet overhead becomes significant, requiring careful network topology planning to mitigate latency.

Scaling Characteristics

Cross-Node LatencyCross-node communication is supported via GPUDirect RDMA, but latency is influenced by network configuration and bandwidth.
Network BottlenecksThe primary bottleneck is the Host-to-Device bridge and absence of NVLink, which limits efficient data transfer between GPUs.
ParallelismSupports Data and Model Parallelism, with potential for Pipeline and Tensor Parallelism using frameworks like DeepSpeed or Megatron.

Workload Readiness

LLM Training

The Radeon AI PRO R9700, based on its architecture and VRAM capacity, is suitable for training models up to 70B parameters in a multi-node setup. Its architecture likely supports efficient parallel processing, but may not match the highest-end GPUs for 400B+ models.

LLM Inference

Expected to perform well for LLM inference with a decent token-per-second rate, but may face limitations with very large models due to potential VRAM constraints.

Vision Training

Capable of handling large-scale vision training tasks efficiently, leveraging its architecture for high throughput in image processing.

Diffusion Models

Suitable for training and inference of diffusion models, benefiting from its architecture's parallel processing capabilities.

Multimodal AI

Well-suited for multimodal AI tasks, leveraging its architecture to handle diverse data types and operations efficiently.

Reinforcement Learning

Effective for reinforcement learning workloads, providing sufficient computational power and parallelism for complex simulations.

HPC / Simulation

May have limited FP64 support, which could restrict its performance in traditional HPC simulations requiring high precision.

Scientific Computing

Suitable for scientific computing tasks that do not heavily rely on double precision, leveraging its architecture for parallel computations.

Edge Inference

Potentially efficient for edge inference tasks, assuming a moderate TDP and compact form factor, making it suitable for deployment in constrained environments.

Real-Time Serving

Capable of real-time AI serving, with architecture optimized for low-latency operations and efficient data throughput.

Fine-Tuning

Supports full fine-tuning efficiently, provided the VRAM is sufficient for the model size, making it suitable for high VRAM tasks.

LoRA Efficiency

Highly efficient for LoRA fine-tuning, benefiting from lower VRAM requirements and optimized architecture for parameter-efficient tuning.

Market Authority

Key Strengths

No specific strengths can be identified for this model.

Limitations

No limitations or trade-offs can be identified for this model.

Expert Insight

The Radeon AI PRO represents a powerful alternative for diversified workloads. When comparing cloud providers, consider not just the hourly rate, but also the interconnect bandwidth (InfiniBand/NVLink) and regional availability which can significantly impact total cost of ownership for large-scale training.

Glossary Terms

FP32 TFLOPS
VRAM
TDP
Cores
Information updated daily. Cloud pricing subject to vendor availability.