AMD · 2025-01-01

Instinct MI300X

MI300X

The AMD Instinct MI300X discrete GPU is based on next-generation AMD CDNA 3 architecture, featuring 304 high-throughput compute units, AI-specific functions, and 192 GB of HBM3 memory. It offers outstanding performance for demanding AI and HPC applications, with a focus on generative AI, machine learning, and inferencing.

Instinct MI300X MI300X
VRAM
192GB GB
FP32 TFLOPS
164.6 TFLOPS
TDP
750 W

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On-DemandGlobal Availability
$1.71/ hour
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$1.85/ hour
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Compute Performance

FP6482.3 TFLOPS TFLOPS
FP32164.6 TFLOPS TFLOPS
TF32Not Supported TFLOPS
FP16330.6 TFLOPS TFLOPS
BF16330.6 TFLOPS TFLOPS
FP8661.3 TFLOPS TFLOPS
INT8661.3 TOPS TOPS
INT4Not Published TOPS

Architecture

MicroarchitectureCDNA 3
Process NodeTSMC N5
Die SizeMCM (total area Not Published)
Transistors
Compute Units304 CUs
Tensor CoresAI Accelerators: 304
RT Cores
Matrix EngineMatrix Core
Base Clock
Boost Clock
Transformer Engine
Sparse AccelerationSupported (2:4 structured sparsity)
Dynamic PrecisionSupported (FP8/FP16/BF16)

Memory & VRAM

Memory TypeHBM3
Total Capacity192GB GB
Bandwidth5.2TB/s
Bus Width6144-bit
HBM Stacks8
ECC SupportYes (Inline)
Unified MemoryNot Supported
Compression
NUMA Awareness
Memory PoolingYes (AMD Infinity Fabric pooling)

Connectivity & Scaling

InterconnectInfinity Fabric
GenerationxGMI Gen 3
IB Bandwidth896 GB/s
PCIe InterfacePCIe Gen 5 x16
CXL Support
TopologyFully-connected 8-GPU xGMI mesh (HGX MI300X platform)
Max GPUs/Node8
Scale-OutYes (via InfiniBand NDR or RoCE v2)
GPUDirect RDMAYes
P2P MemoryYes (via xGMI and HBM coherent memory)

Virtualization

MIG SupportNot Supported
MIG PartitionsN/A
SR-IOVSupported
vGPU ReadinessSupported (AMD MxGPU)
K8s ReadinessSupported via Device Plugin
GPU SharingSR-IOV, Time-Slicing
Virt EfficiencyNear bare-metal (vendor claim)

Power & Efficiency

TDP750 W W
Peak Power760-800 W
Idle Power70-100 W
Perf / WattUp to 1.6 TFLOPS/W (FP16, theoretical peak)
PSU RequiredN/A
ConnectorsDirect liquid-cooled busbar or custom high-current connector (OEM dependent)
Thermal LimitsLiquid cooling required; max case temperature ~45°C inlet
EfficiencyData center-grade, optimized for high sustained throughput; no standard 80 PLUS rating

Physical Design

Form FactorOAM (Open Accelerator Module)
FHFLN/A
Slot WidthN/A
Dimensions165 mm x 102 mm
Weight1.8–2.2 kg
CoolingDirect liquid cooling (cold plate), some air-cooled variants possible
Rack DensityOptimized for high-density OAM baseboards (e.g., 8 OAM modules per tray)

Thermals & Cooling

AirflowServer chassis airflow required (Not Published)
Temp Range0°C to 45°C
ThrottlingThermal-based clock reduction at Tjunction limit
Noise LevelNot Applicable (Passive Module)
Liquid Cooling
DC HeatHigh (rack-scale deployment recommended)

Software Ecosystem

CUDANot Supported
ROCmROCm 5.x supported
oneAPINot Supported
PyTorchOfficially supported
TensorFlowOfficially supported
JAXExperimental via ROCm
HuggingFaceCommunity support
Triton ServerLimited/Experimental
DockerOfficial container images available
Compiler StackROCm LLVM-based stack
Kernel OptimUpstream Linux kernel support for AMD Instinct GPUs documented
Driver StabilityProduction stable

Server & Deployment

OEM AvailabilityTier-1 OEMs: Dell, HPE, Supermicro
Preconfigured4U 8-GPU systems
DGX/HGXCore of HGX baseboards
Rack-ScaleNVLink Switch System, InfiniBand scale-out
Edge DeployNot typically suitable for edge deployment due to high TDP
Ref ArchitecturesNVIDIA MGX, SuperPOD

System Compatibility

CPU PairingDual-socket EPYC 9004 class recommended
NUMAStandard NUMA behavior
Required PCIeNot Applicable (SXM/OAM)
MotherboardOAM socket required; platform-specific baseboard
Rack PowerContact vendor for rack power planning
BIOS Limits
CXL ReadyNot Supported
OS CompatRHEL and Ubuntu LTS supported; Windows support not published

Benchmarks & Throughput

Structured Sparsity

Not Supported

Transformer Throughput

Supported (AMD XDNA AI Engine / Matrix Core)

Multi-GPU Scalability

Scaling Efficiency

Single GPUThe Instinct MI300X is optimized for high throughput with its advanced architecture, providing excellent single GPU performance.
2-GPUScaling between two GPUs is efficient, leveraging PCIe Gen5 bandwidth, though not as optimal as NVLink.
4-GPUScaling across four GPUs is feasible but limited by PCIe lane contention, impacting P2P bandwidth.
8-GPUScaling to eight GPUs shows diminishing returns due to PCIe bandwidth constraints and lack of NVLink.
64+ GPUAt large scales, InfiniBand or RoCE v2 overhead becomes significant, requiring careful network topology design to minimize latency.

Scaling Characteristics

Cross-Node LatencyGPUDirect RDMA support helps reduce cross-node latency, but efficient multi-rail networking is crucial for maintaining performance.
Network BottlenecksThe primary bottleneck is the Host-to-Device bridge and PCIe bandwidth limitations, as well as potential VRAM pressure.
ParallelismSupports Data, Model, Pipeline, and Tensor Parallelism, compatible with frameworks like DeepSpeed and Megatron for efficient distributed training.

Workload Readiness

LLM Training

The Instinct MI300X is highly suitable for training large language models, including 400B+ parameters, especially in multi-node configurations due to its advanced architecture and substantial VRAM capacity.

LLM Inference

Optimized for high token-per-second throughput and ample KV cache headroom, making it ideal for inference tasks with large models.

Vision Training

Well-suited for vision training tasks, leveraging its high computational throughput and memory bandwidth to efficiently handle large datasets and complex models.

Diffusion Models

Capable of efficiently training and running diffusion models due to its high parallel processing power and memory capacity.

Multimodal AI

Highly effective for multimodal AI applications, benefiting from its ability to handle diverse data types and large model architectures simultaneously.

Reinforcement Learning

Excellent for reinforcement learning workloads, providing the necessary computational power and memory bandwidth for complex simulations and model training.

HPC / Simulation

Strong support for HPC simulations with robust FP64 performance, making it suitable for scientific and engineering applications requiring high precision.

Scientific Computing

Ideal for scientific computing tasks, offering high double-precision performance and memory capacity for large-scale computations.

Edge Inference

Less suitable for edge inference due to potentially higher power consumption and larger form factor, which are not optimal for edge deployments.

Real-Time Serving

Capable of real-time AI serving with high throughput and low latency, suitable for demanding AI applications requiring quick response times.

Fine-Tuning

Highly efficient for full fine-tuning tasks, thanks to its large VRAM capacity and computational power.

LoRA Efficiency

Efficient for LoRA fine-tuning, providing sufficient resources for parameter-efficient training methods.

Market Authority

Cloud Adoption

AMD confirmed Microsoft Azure adoption (public announcement, Nov 2023).

Supercomputer Usage

Confirmed in El Capitan (DOE/Livermore), Frontier (upgrade), and other US DOE exascale systems.

Research Citations

Limited; early-stage citations in arXiv and conference preprints as of H1 2024.

Community Benchmarks

Sparse; some preliminary results from AMD and select academic labs, but not widely available.

GitHub Support

Initial ROCm support for MI300X present; growing but not yet widespread in major ML repos.

Key Strengths

The MI300X excels in AI and HPC workloads with its advanced architecture.

  • ·AI Training: Optimized for large-scale AI model training with high throughput.
  • ·HPC Performance: Delivers exceptional performance for high-performance computing tasks.
  • ·Memory Bandwidth: Features high memory bandwidth for data-intensive applications.

Limitations

The MI300X has some limitations in terms of availability and specific workload optimizations.

  • ·Availability Constraints: May have limited availability due to high demand and production constraints.
  • ·Workload Optimization: While strong in AI, may not be as optimized for certain niche workloads compared to competitors.

Expert Insight

The Instinct MI300X represents a powerful alternative for diversified workloads. When comparing cloud providers, consider not just the hourly rate, but also the interconnect bandwidth (InfiniBand/NVLink) and regional availability which can significantly impact total cost of ownership for large-scale training.

Glossary Terms

FP32 TFLOPS
VRAM
TDP
Cores
Information updated daily. Cloud pricing subject to vendor availability.